ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,162, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Cooler and semiconductor device" was invented by Naoki Yoshimat... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,163, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device" was invented by Tadatsugu Yamamoto (Fukuo... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,164, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and cooling system the... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,165, issued on July 14, was assigned to GUANGDONG OCEAN UNIVERSITY (Zhanjiang, China). "Chip cooling platform based on micro-nano structure... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,166, issued on July 14. "Semiconductor device and method for making the same" was invented by ChangOh Kim (Incheon, South Korea), SeungHyun... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,167, issued on July 14, was assigned to Cisco Technology Inc. (San Jose, Calif.). "Heatsink for ring type integrated circuits" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,168, issued on July 14, was assigned to CCHUAN Co. LTD. (Taoyuan City, Taiwan). "Leak-proof heat dissipation structure of high thermal cond... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,169, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Flip chip packaged devices with thermal interposer" was invented ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,170, issued on July 14, was assigned to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Wuhan, China) and WUHAN CHINA STAR OPTOELECTRO... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,171, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor package with extended stiffener" was invented by ... Read More